21-0159 SPC, OBVOD, FUNKCIE
Časť Meno: 21-0159
Výrobca: DALLAS[Dallas Semiconductor]
Balenie:
Opis: 210159
Kolíky:
Teplota: Min °C | Max °C
Veľkosť: KB
- 21-0056-C
PACKAGE OUTLINE, SSOP, - 21-0056C
PACKAGE OUTLINE, SSOP, - 21-0075
21-0075 - 21-0076B
PACKAGE OUTLINE, SC70, - 21-0098B
PACKAGE OUTLINE, SC70L - 21-0102
PACKAGE OUTLINE, 12,16L 3x3x0.90 - 21-0109B
PACKAGE OUTLINE, uMAX, EXPOSED - 21-0110
PACKAGE OUTLINE, TQFP, 5x5x1.0mm - 21-0114
PACKAGE OUTLINE, LEAD THIN SOT23, PROFILE) - 21-0114B
PACKAGE OUTLINE, LEAD THIN SOT23, PROFILE) - 21-0117G
PACKAGE OUTLINE, UCSP - 21-0125A
PACKAGE OUTLINE - 21-0132A
21-0132A - 21-0136F
PACKAGE OUTLINE 1216L THIN 3x3x0.8mm - 21-0139A
PACKAGE OUTLINE